Abstract
A simple technique is given for measuring stresses in reflecting thin films, using real-time holography. The technique gives clear real fringes with good visibility which can be easily monitored and photographed. No substrate profile measurement is needed. Thermal stress of 0.49 × 10 9 dynes cm -2 is observed for a 200.0 nm thick Ag film in the temperature range of 30 to 55°C. This is in good agreement with reported values.
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