Abstract
Traditional backlights are designed with new dot patterns, and then injection molding, laser beam fabrication, or UV (Ultraviolet) roll-to-plate imprinting is used to apply dot patterns to a light guide plate—the process consumes considerable time and resources. Therefore, we propose a novel light guide design that does not use a dot pattern. We designed an asymmetric intensity distribution of mini-LEDs (Light Emitting Diode) and a light guide plate with a fully printed diffusion reflection on the bottom surface for a planar illuminator. The design rules for the proposed architecture are described in this paper. The archetype design with a 152.4 mm circular down-light has a diameter of 143 mm for the planar light source module. The experiment achieved a total efficiency of 85% and uniformity of 92.6%.
Highlights
Light-emitting diodes (LEDs) are a popular light source, because they offer many advantages such as a high energy efficiency and good color performance; an LED is a point light and requires a backlight module in order to transform it into a planar light source
Dot patterns have been applied on light guide plates using molecular potential energy
An adaptive neuro-fuzzy inference system was used for generating diffuser dot patterns in light guides in one study [3]
Summary
Light-emitting diodes (LEDs) are a popular light source, because they offer many advantages such as a high energy efficiency and good color performance; an LED is a point light and requires a backlight module in order to transform it into a planar light source. Many studies have been conducted on the design of dot patterns in the interest of achieving a high uniformity and efficiency for the light guide plate. Process of a lead frame, all of which packages, the ability to withstand a highof current density, and the absence such wire aalower ofof help Using in the flip design of offers asymmetric intensity distribution (AID). Using flipchips chips offersmany manyadvantages, advantages, suchas asno no wirebonding, bonding, lowerthermal thermal resistance packages, the ability to withstand a high current density, and the absence of a lead frame, all of which used an AID mini-LED the flip chip type, employing a chip 740 μm. The first step of the packaging process involves depositing a phosphor used an AID mini-LED of the flip chip type, employing a chip size of 740 μm × 260 μm × 150 μm. The first step the packaging process involves depositing phosphor film on a glass substrate.
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