Abstract

We have developed a new cell technology with extremely small cell size of 0.14 /spl mu/m/sup 2/ using 0.12 /spl mu/m process. The self-aligned shallow trench isolation (SA-STI) and self-aligned source (SAS) structure are adopted to minimize the cell size. To scale down the cell gate length and to improve the cell performance, high aspect-ratio floating gate and channel erasing scheme are used. Excellent endurance characteristics, tight threshold voltage distribution and good reliability have been verified in this work.

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