Abstract

A fluorinated poly(phenylene ether ketone) encapsulant has been identified as a high-performance chemically reworkable thermoplastic with near hermetic protection. The 12F-PEK has legacy as a high-reliability microelectronics coating for bare silicon and gallium arsenide die and microelectronics packages including PEM, CSP, PCB, COB, SCM, MCM, and MEMS. It has recently been discovered that the 12F-PEK coating is a peripheral packaging candidate for MOEMS, electro-optical, and micro-scale optical applications. Characterization of the 12F-PEK encapsulant revealed a refractive index of 1.51 from 200-900nm, 90% transmission from 1000-2100nm, 0.07% moisture absorption, and no failures at 85/spl deg/C/85% RH/5V Bias/2500 hours with Sandia ATC 2.6 TVs. The low water absorption and long-term stability of the 12F-PEK fluoropolymer presents a novel approach for packaging optical systems that will be subjected to hostile environmental conditions.

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