Abstract
A fine-pitch chip-on-glass (COG) bonding technique for liquid-crystal display (LCD) panels is described. An IC chip with gold (Au) bumps was dipped in a stirred indium-tin (InSn) alloy bath in a nitrogen atmosphere without flux. Shallow-bowl-shaped InSn alloy bumps were selectively formed on the Au bumps on the IC electrodes. The minimum examined bump pitch was 50 mu m, and the bump size was 31*31 mu m. The InSn alloy bumps, which had minimum pitch of 100 mu m, were connected to molybdenum (Mo) conductors without flux at low pressure (30 gf/bump or less) and low temperature (110 degrees C or less). The temperature was lower than the alloy melting point. The mean contact resistance was 0.78 Omega . The technique allows easy repair. A thermal shock test, a high-temperature and high-humidity storage test, and a high-temperature storage test showed that the contact resistance changes satisfied the specification, which allows up to 10 Omega . Prototype thin-film-transistor (TFT) LCD panels with 80- mu m pitch-driver ICs were developed using the new bonding method.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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