Abstract
In this paper we present large-scale numerical models for underfill encapsulation processes. The numerical formulation consists of the finite element method coupled with the volume of fluid technique and is based on generalized Hele–Shaw equations. The material behavior is modeled using rheologic kinetic models to predict material bulk properties (i.e. viscosity) and reactions models during the curing process (i.e. gel time). Some simulation examples are presented that demonstrate the applicability of the models to the underfill encapsulation process.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.