Abstract
In this paper we present large-scale numerical models for underfill encapsulation processes. The numerical formulation consists of the finite element method coupled with the volume of fluid technique and is based on generalized Hele–Shaw equations. The material behavior is modeled using rheologic kinetic models to predict material bulk properties (i.e. viscosity) and reactions models during the curing process (i.e. gel time). Some simulation examples are presented that demonstrate the applicability of the models to the underfill encapsulation process.
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