Abstract
AbstractUltrasonic wire bonding is a dominating interconnection technique that has been applied in packaging industry for decades. The phenomena at the wire/substrate interface and the wire/tool interface, however, are not clear yet. Specifically, the motion behaviors of the wire during the bonding process have to be deeply understood. In this project, the relative motion amplitudes at the wire/tool interface and the self-cleaning efficiency at the wire/substrate interface are investigated via the analysis of an artificially coated layer. For each experiment, a thin layer made of a specific material was coated onto the surface of a 400 μm wire by physical vapor deposition. The change of thicknesses of the layer was observed by a scanning electron microscope after the bonding process. The results indicated a complex relative motion behavior at the wire/tool interface. The relative motion amplitude at the fillets contact regions is higher than that at the other contact perimeter regions while the amplitude at the central area is the lowest. The insignificant influence of a 200 nm aluminum oxide layer on the bonding quality demonstrated the high self-cleaning efficiency of the wedge-wedge bonding process.
Published Version
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