Abstract
A Cost-Effective Antenna-in-Package Design With a 4 × 4 Dual-Polarized High Isolation Patch Array for 5G mmWave Applications
Highlights
With the growing need for higher data rate services, millimeter-wave communications have received great attention in both industry and academia [1]
Modern mmWave multiple-input multiple-output (MIMO) antennas are usually designed based on the antennain-package (AiP) interface approach, in which integrated chips are packaged on the antenna surface or inside the cavity built into antennas to offer low interconnection losses [4]
The dualpolarized AiPs implemented using low-temperature co-fired ceramic (LTCC) technology were reported in the literatures [7]–[9]
Summary
With the growing need for higher data rate services, millimeter-wave (mmWave) communications have received great attention in both industry and academia [1]. The dualpolarized AiPs implemented using low-temperature co-fired ceramic (LTCC) technology were reported in the literatures [7]–[9] They provide superior performance in terms of efficiency, loss, and gain and offer a high degree of integration with the aid of the LTCC process [10]. Note that the minimum required isolation in mmWave systems is as high as 24 dB when the 256-QAM modulation scheme is used [25] To overcome this drawback, a design technology on the dual-polarized AiPs that is cost-effective and achieves better performance need to be studied. We propose a cost-effective AiP design with a dual-polarized high isolation patch array for 5G mmWave applications.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
