Abstract

We examine correlations between the recombination lifetime and hydrogen content of hydrogenated amorphous silicon films (a-Si:H) and the surface passivation afforded by such films when deposited on crystalline silicon wafers, during annealing at 350–500 °C. Our results show that, as the annealing duration increases, both the a-Si:H recombination lifetime and the surface recombination velocity evolve at a similar rate to the hydrogen concentration. This suggests that the loss of hydrogen during annealing is the direct cause of the reduction in the a-Si:H film lifetime, and that the loss of hydrogen occurs both at the a-Si:H/c-Si interface as well as in the bulk of a-Si:H film. We calculated the activation energy of the surface depassivation reaction during annealing to be 0.62 ± 0.1 eV, which suggests that the depassivation reaction is limited by the migration of hydrogen within the film, without significant hydrogen trapping. Secondary-ion mass spectrometry further demonstrates the loss of hydrogen across the film thickness during annealing.

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