A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate

Y.C Liang,Jun Cai Jun Cai,Zhaoxia Gao Zhaoxia Gao,N Balasubramanian,Pick Hong Ong Pick Hong Ong,Wenjiang Zeng Wenjiang Zeng

doi:10.1109/led.2002.805748

A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate

Y.C Liang, Jun Cai Jun Cai + Show 4 more

https://doi.org/10.1109/led.2002.805748

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Journal: IEEE Electron Device Letters	Publication Date: Dec 1, 2002
Citations: 38

Affiliation: National University of Singapore, Institute of Microelectronics

#Bulk Silicon #Sidewall Patterning + Show 6 more

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Abstract

In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.

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