Abstract
Temperature-ramp resistance analysis to characterize electromigration (TRACE) can yield electromigration damage (EMD) kinetic parameters in times as short as a day. Until now, there has been no systematic comparison of kinetic parameters determined by TRACE and median time to failure (MTF). In this work, two groups of Al-4%Cu conductors were tested by both techniques. The average activation energy for EMD was determined by the TRACE technique to be 0.69 eV. This value is in excellent agreement with the value obtained from life testing. The t 50 calculated from TRACE is shorter than the measured MTF value by a factor of approximately ten.
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