Abstract
A study of the electron beam sensitivities and oxygen plasma etch rates of a variety of organosilicon polymers is discussed. The particular structures investigated include polysiloxanes, polysilmethylenes, polysilazanes. polysilanes, polysilphenylenes, and organic polymers with side silyl groups.The influence of pendant organic groups and heteroatoms in the main polymer chain on the plasma etch rates and electron beam sensitivities is also addressed.
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