A Comparative Performance Analysis of Copper and MWCNT Bundle Interconnects in Ternary Logic

Abstract

This study presents a comparative performance analysis including delay, power and power-delay product (PDP) of ternary systems using copper and large diameter MWCNT bundle interconnects at 14 nm technology node. Comparisons are done for intermediate interconnects and repeated and unrepeated global level interconnects. It is shown that at the intermediate level, MWCNT bundle interconnects can achieve about 55% lower delay and PDP than their copper counterparts. Similar to the intermediate level, for unrepeated global level interconnects, MWCNT bundle interconnects have lower PDP as compared to Cu wires. This improvement is about 5% for unrepeated global interconnects. For repeated global interconnects copper wires have about 14% lower PDP than the repeated global level MWCNT bundle interconnects while the number of repeaters for these wires is more than the number of repeaters for MWCNT bundle interconnects.