Abstract
This paper presents a compact reflectionless low-pass filter based on through-silicon via (TSV). Its overall structure is composed of TSV inductors and redistribution layer(RDL) capacitor. The high-frequency structure simulator (HFSS) validates the proposed reflection filter. The results show that the filter operates at a frequency of 0-6.6GHz, with The return loss of input and output is less than -14.6dB in all test frequency bands(0-30GHz). In addition, the size of the reflectionless filter is only 0.19×0.23×0.0139 mm3 (0.014× 0.017×0.01 λg3).
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
