A compact fifth-order SIW BPF based on TSV technology with high selectivity

Abstract

In this paper, a fifth-order Substrate Integrated Waveguide (SIW) filter using Through-Silicon Via (TSV) technology is proposed. The slots on the top and bottom redistribution layers (RDL) of the filter provide negative coupling and a finite transmission zero (FTZ). This effectively improves stopband attenuation. Asynchronous tuning is applied to the coupling path of this component. The center frequency of the filter is 3.6 GHz (fractional bandwidth is 3.50 %). The minimum insertion loss is 1.58 dB, the minimum return loss is 23.6 dB, and the overall size is 1.855 × 1.316 mm2. The simulation results show that the proposed SIW filter can achieve better in-band characteristics and selectivity with the similar size or smaller size as compared to the SIW filter operating at the similar frequency.