Abstract
In this work, a substrate integrated waveguide (SIW) filter based on through-silicon via (TSV) technology is proposed to realize the filtering function in the terahertz (THz) band. The Generalized Chebyshev function is used to synthesize the coupling matrix, and cross coupling is realized by etching interdigital grooves on the upper redistribution layer (RDL), so as to generate finite transmission zeros to improve out of band suppression performance. The S-parameter results show that when the insertion loss is less than 2dB, the passband bandwidth is from 262.3GHz to 301GHz, and the center frequency is 281GHz, while the relative bandwidth is 13.7%. The minimum insertion loss (S21) is 1.4dB, the minimum return loss (S11) is 13.1dB, and the overall size is 0.773 x 0.44mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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