Abstract
An alternative method to describe the temperature profiles of bimaterial systems for resistive heating is proposed. The thermal model based on the solution of a second order harmonic oscillator equation, is interpreted as a function of the oscillating parameters. We highlighted the importance to select adequately the initial conditions to reproduce the experimental results more realistic, as well as the inclusion of the diffusion time constant as a key parameter for interpretation. We discussed the theoretical temperature profiles obtained and the experimental results obtained on film and substrate by means of K-type micro thermocouples for different bimaterial systems such as Au/glass, Au/Si, Al/glass and Al/Si. A better agreement was found with the bimaterial model proposed as compared with the reported before. We found that physical properties and geometrical data play an important role on the temperature profiles obtained. (© 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
