Abstract
This paper designs a vertical-interconnect transmission structure which could be applied in PoP(Package on Package) package structure. In this model, Through Mold Via(TMV) transmission structure is utilized to realize inter-side and stacked-model interconnection. A quasi-coaxial via cluster connected to the strip line is designed for vertical RF transmission. It was found that the center distance between core via and shielding vias and diameter of those vias have great influence on performance of the transmission structure, which requires optimization specifically. The optimized size of this interconnection structure is 4mm×4mm×4mm based on ANSYS HFSS. The simulation results show a good performance of S-parameters in a large bandwidth from 1GHz to 6GHz, which verifies the prospects of its application in RF-front PoP structure.
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