Abstract
A monolithic integrated linear power amplifier (PA) for 5GHz WLAN application has been realized in 0.35mum-SiGe BiCMOS technology. The single-ended 3-stage power amplifier uses on-chip inductors and bond-wire inductance for input and interstage matching. Under a single supply voltage of +3.3V, the SiGe HBT MMIC power amplifier exhibits linear output power of 26.4dBm (P1dB), small signal gain of 24.7dB and the power added efficiency (PAE) of 29.2% at P1dB. The die size is only 1.2mmtimes0.8mm
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