Abstract
A partially depleted silicon-on-insulator (PDSOI) CMOS technology employing pocket implantation and a self-aligned titanium silicidation with an effective gate length of 0.13 /spl mu/m has been developed. An advanced mesa isolation process is used to suppress corner devices. A clear improvement of the device performance due to the novel isolation process is shown. Good transfer characteristics with a steep subthreshold slope and an excellent roll-off of threshold voltage is obtained for both nMOS and pMOS devices down to effective gate lengths of 0.13 /spl mu/m. A 10 k transistor circuit which is mostly combinatoric (carry select adder circuit) has been realized and characterized as a performance test circuit with an effective gate length of 0.18 /spl mu/m and shows high performance and low power consumption compared to an optimized 0.18 /spl mu/m effective gate length bulk technology with similar processing.
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