Abstract
This chapter explores what the future holds for powerful devices like intelligent sensors, and the dsPIC digital signal processing (dsPIC DSC) chip that provides an excellent foundation upon which to build a wide variety of intelligent sensors. Intelligent sensors consist of three basic building blocks—sensing elements, computational elements, and communication interfaces—and the underlying technologies of all three building blocks are evolving at a rapid pace. The near future will witness an explosion in the capabilities of intelligent sensors, an explosion that will improve functionality and connectivity significantly while simultaneously reducing system cost. Three key economic developments will drive the future adoption of intelligent sensors: the demographics of an aging population, the increasing globalization of operations, and the creation of new business opportunities. All three trends point to a strong increase in the demand for intelligent-sensing systems.
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