Abstract
With the rapid industrialization, various advanced technologies have been grown up which helps in saving time, reducing cost, reliable fabrication, and production of complex products. The micro-joining and nano-joining are two techniques among such advanced technologies closely associated with microelectronic packaging and manufacturing units such as electronics, precision, medical industries. This chapter provides a comprehensive overview of the fundamental aspects of micro-joining and nano-joining techniques including the bonding mechanism and various numerical and analytical modeling. The current area of applications where these two techniques have been incorporated reviewed and future scope of these two techniques has brought in to light.
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