Abstract
Plasma‐Polymerized Hexamethyldisiloxane (pp‐HMDSO) was developed as buffer layer by plasma enhanced chemical vapor deposition (PECVD) together with SiN barrier layers to form thin film encapsulation (TFE) stack that can reduce the whole TFE thickness to less than 1µm for an ultra‐high resolution Micro‐OLED application. The pp‐HMDSO film featured excellent particle coverage was close to 100% transmittance in the whole visible light region and was nearly stress free.
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