Abstract
Magnetic tunnel junctions (MTJs) with structures of Ta(5)∕Cu(10)∕Ta(5)∕Ir21Mn79(10)∕Co75Fe25(2)∕Ru(0.75)∕Co40Fe40B20(3)∕Al(0.6)–O∕Co40Fe40B20(2.5)∕Ta(3)∕Ru(7) (units in nanometers) were deposited via ultrahigh vacuum magnetron sputtering (ULVAC). Microscale ring-type magnetic tunnel junctions (RMTJs) with an outer radius of 2μm and an inner radius of 1μm were patterned using standard UV lithography combined with ion milling. Both reference and free layers were Co40Fe40B20 and a very thin Al–O (0.6nm) barrier layer was used. Tunneling magnetoresistances (TMRs) of up to 81% at room temperature and 107% at 4.2K were observed. These RMTJs with high TMR and low coercivity, of about 26Oe, combined with the ring-type geometry, which greatly reduces stray magnetic field, are ideal for certain magnetic field sensor applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
