Abstract
We present a cryogenic system design and development for ice lithography. The cryo-stage is designed with embedded channels to allow direct liquid nitrogen flow, enabling fast cryogenic cooling, and low sample temperature. The stage cools down to 78.8 K in 20 min and heats up to room temperature in 15 min, which increases throughput significantly. Compared to the previous designs, the new system reduces cooling time by 85%, and it is 50 K colder. The cryo-stage is fabricated using copper, aluminum, and polyether ether ketone (PEEK) polymer. Numerical simulations show that the thermal stress on the cryo-stage during the cooling process remains well below stage materials' mechanical yield limits. Finally, the lower stage temperature enables us to explore new precursors, materials, and applications, which we demonstrate by combining ice lithography with printed flexible electronics technology.
Highlights
With the advancement of nanotechnology and three-dimensional (3D) micro-and nano-scale manufacturing, several interdisciplinary fields, like, nanophotonics, electronics and biomedical engineering, have adopted them [1,2,3,4]
The ice lithography (IL) process composes condensing precursor gases on the substrate held at cryogenic temperature and vacuum, as illustrated in Fig. 1, exposes the ice resist by high energy focused electron beam (e-beam) for patterning
Cryogenic temperature source is introduced to the embedded channel walls
Summary
K., Jaemin, K., Briand, D., & Han, A. Users may download and print one copy of any publication from the public portal for the purpose of private study or research. Kim Jaemin b, Danick Briand b, Anpan Han a,*.
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