6 - Physical Sputtering and Sputter Deposition (Sputtering)

Abstract

This chapter discusses the physical sputtering and sputter deposition. The physical sputtering process involves the physical vaporization of atoms from a surface by momentum transfer from bombarding energetic atomic-sized particles. Sputter deposition, which is often called just sputtering, is the deposition of particles whose origin is from a surface being sputtered. Sputter deposition was not widely used in industry until the need developed for reproducible, stable long-lived vaporization sources for production and the advent of magnetron sputtering. Typically, the use of the term sputter deposition only indicates that a surface being sputtered is the source of the deposited material. In some cases, the sputtering configuration may be indicated. In some cases special sputtering conditions may be indicated, such as reactive sputter deposition for the deposition of compound films or bias sputtering when a bias is placed on the substrate so that there is concurrent ion bombardment of the depositing film.