Abstract

Edge termination structures that are insensitive to process deviations were investigated to obtain 6.5 kV SiC power devices with stable blocking characteristics. Edge terminations were designed and verified by a TCAD simulation in consideration of undesirable surface charge states and variation of the implantation window in the termination region. A constant-space floating guard ring (CS-FGR) was sensitive to the variation of the implantation window. A gradually increasing space (GIS) FGR was less sensitive to process deviations than the CS-FGR. We concluded that the GIS-FGR is sufficiently stable for use in high-voltage SiC devices at surface charge densities (Q<SUB>surf</SUB>/q) of 0 to −1 × 10<SUP>12</SUP> cm<SUP>−2</SUP> and implantation window variations of −0.3 to +0.3 μm. The optimized GIS-FGR exhibited a high breakdown voltage of over 8 kV at all the Q<SUB>surf</SUB>/q values and in the implantation window variation range considered in this paper.

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