Abstract
AbstractIn this paper, we introduced nanocomposite materials as a debonding layer (DBL) in the fabrication of flexible displays. These materials provided flexible substrate with good debonding capability even after 450oC low‐temperature poly‐silicon (LTPS) process. The effect of temperature on debonding force of flexible substrate was investigated. Besides, some characteristics of thin‐film transistors (TFT) were also studied.
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