Abstract
A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13m CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-flred Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF bufier ampliflers, matching elements, baluns, bond wires and package transmission lines. This is the flrst ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless- interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.
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