An LTCC Based H-Antenna Aperture Coupled to an On-Chip Antenna for 2.4 GHz Long Range Transmitters

Abstract

Package antennas designed at lower GHz frequencies and aperture coupled to on-chip antennas help to provide fully integrated System-in-Package transmitters with high gain, efficiency and lower power consumption. In this paper, a superstrate H-antenna with H-shaped ground plane is used as a package antenna which provides high gain and miniaturization. The package antenna is aperture coupled to a two-turn on-chip loop antenna, which is conjugately matched to a differential Class-E power amplifier (PA) with current reuse. The PA, along with the antenna system, helps to increase the communication range of transmitter. PA and on-chip antenna are designed in UMC 180nm technology, while the package antenna is designed in Low Temperature Co-fired Ceramic (LTCC) package. From the post-layout simulations performed in Cadence virtuoso, the PA has a maximum output and power added efficiency (PAE) of 19 dBm and 50%. H-antenna and loop antenna are simulated in Advanced Design System (ADS). From the simulations, the on-chip loop antenna has a gain and efficiency of −20.5 dBi and 0.42%. The aperture coupled H-antenna has a gain and efficiency of −1.6 dBi and 17.2%. The proposed design has higher gain and smaller size compared to the design proposed in literature, hence can be used for long range wireless applications.