Abstract
We developed a simultaneous transfer and bonding (SITRAB) process based on laser‐assisted bonding with compression (LABC) and our proprietary SITRAB adhesive technology. As its name implies, the SITRAB process performs transfer and bonding simultaneously, unlike the conventional sequential process, in which transfer is followed by the bonding process. SITRAB's process time is less than 6 s. The SITRAB adhesive was developed in the form of a paste and a film, and an appropriate type of adhesive can be applied depending on the applications. The adhesive was proved to be applied as SnAg and In solders during the SITRAB process. Two 35 × 35 arrays of 80 µm × 130 µm sized mini LEDs with a 288 µm pitch with SnAg or In interconnects have been successfully processed. The repair process based on SITRAB technology was proposed and confirmed experimentally.
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