53‐3: High‐Efficiency MicroLED Displays Enabled Through PulseForge Assisted Die Transfer

Abstract

A pathway to scalable microLED mass‐transfer technology utiliz‐ing a PulseForge assisted die transfer process (PATP) was studied. PATP involves an intermediate glass carrier (IC) coated with an inorganic release layer to transfer an array of LEDs over a 150 mm×75 mm area. To demonstrate the feasibility of this process, an array of 15×15 µm 2blue microLEDs were integrated onto a sili‐con substrate. The transferred LEDs had a 55% peak external quantum efficiency (EQE) compared to a peak EQE of 26% for LEDs on sapphire substrates.