Abstract
Ultraviolet (UV) light-emitting diode (LED) epilayers were grown on low dislocation density (1×108/cm2) GaN templates with sapphire substrates. Then, the GaN templates and sapphire substrates were removed using laser-induced lift-off and polishing techniques. Additionally, to enhance the extraction efficiency, this LED chip used a higher reflectance Ag p-type electrode, patterned surface, and silicone resin molding package. When this UV LED was operated at a forward-bias pulsed current of 1 A at room temperature, the peak wavelength, output power, forward voltage, and external quantum efficiency were 365 nm, 1.5 W, 4.4 V, and 44%, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
