Abstract

In this work, we design a new type of LED chips named MIP (Micro LED in package) chips which are composed of three or more sub‐pixel LED chips. Compared with traditional Micro LED chips, MIP can achieve EL measurement and high transfer yield. The structure and optical performance of MIP chips are demonstrated in this work. Moreover, based on MIP chips, we successfully made a Mini LED emissive display product with the pitch 0.5 mm. Such MIP chips provide a new choice for Mini LED display with small pixel pitch.

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