Abstract
In the electronic equipment like personal computers with high heat fluxes for instance, an interstitial material is often introduced between the heat sink and the heat source to reduce the thermal contact resistance (TCR). In the present study, the effect of silicone grease layer with the thermal conductivity 1.1W/(m-K) on TCR between flat rough surfaces has been investigated under relatively low mean nominal contact pressure p_m from about 0.01 to 0.07MPa. As a result, a fairly good reduction effect of TCR has been obtained for about p_m>0.04MPa.
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