Abstract
Limited battery power for wireless devices demands improvement in power efficiency while enhancing system performance. Traditional semiconductor scaling faces challenges to meet this requirement. 3D integration of multiple chips using through silicon via (TSV) is one of the technologies that can extend the performance scaling trend. However, the semiconductor industry will need to overcome many technology hurdles before 3D TSV integration can be implemented in high volume manufacturing, particularlyfor the fabless supply chain. This paper will review the integration challenges and recent progress in process integration, reliability, yield and cost.
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