3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites.

Xinfeng Wu,Ke Yang,Tao Jiang,Ying Wang,Wenge Li,Jinhong Yu,Yuan Gao,Yuantao Zhao,Lingyu Zheng,Kai Sun,Bo Tang

doi:10.3390/polym13060980

Abstract

The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.

Highlights

Over the past few years, the microelectronic industry has been rapidly developed and 5G technology is becoming more mature [1,2]
The SYT45 Carbon fiber (CF) used in this study is a kind of Polyacrylonitrile-based CF (PAN CF)
(3) It can be seen from Figure 5b,c that there are many bonding carbon points between the in-plane CFs, which can bond the in-plane CFs together and increase the thermal conductivity path, promoting the improvement of the thermal conductivity of CF/C/Epoxy composites (CF/C/EP) composites in the in-plane direction

Summary

Introduction

Over the past few years, the microelectronic industry has been rapidly developed and 5G technology is becoming more mature [1,2]. The research and development of materials with high thermal conductivity has become a solution to the problem of heat dissipation. When the filler forms a certain thermal network chain inside the polymer, the thermal conductivity of the composite material will be promoted significantly. When the content of the thermal conductive filler is too high, the granular material is prone to agglomeration, which makes the composite have certain defects and destroys the mechanical property. The thermal conductivity of CF composite material in the vertical direction is 0.53 W/mK, which is 1.65 times higher than that of pure PAI material. When the CF content is 13 vol%, the vertical thermal conductivity of the composite (2.84 W/mK) is about 15 times that of pure epoxy resin. The methods used in this study are simple and can be used in large-scale production, which can provide some suggestions for the application of thermal conductive materials in the microelectronic and aerospace industries

Materials

Findings

Conclusions