Abstract
In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the solder powder and polymer resin. The polymer resin had the smart properties to eliminate the oxide layers on the solder powder and electrode and to form the solder bumps on the electrodes using the rheological behavior of the droplets without any aligning methods. The five chips with TSVs were stacked on a Si interposer with the three redistribution layers (RDL) using the solder bumps formed by SBM and a fluxless underfill material.
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