Abstract
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in miniaturized low power and low mass smart structures in medicine, biology and space applications. Recently similar features found their way inside high energy physics with applications in vertex detectors for high-luminosity LHC Upgrades, with 3D sensors, 3D integration and efficient power management using silicon micro-channel cooling. This paper reports on the state of this development.
Highlights
Micro-fabrication, mainly used for Micro-Electro Mechanical Systems (MEMS), is the process which allows structures to be fabricated three-dimensionally within silicon, or other materials
3D printing, where the fabrication is based on alternating steps of chemical vapor deposition of silicon and local implantation of gallium ions by focused ion beam (FIB) writing, is successfully used for a layer-by-layer fabrication of arbitrarily shaped silicon micro- and nano-sensors [1]
The p þ and nþ electrodes have a mutual distance of 71 μm, and have an average column overlap of 200 μm. This particular configuration allows collecting about 60% of the original signal with a maximum bias voltage of 200 V after a fluence of 5 Â 1015 n cmÀ2, where neutrons are 1 MeV equivalent
Summary
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in miniaturized low power and low mass smart structures in medicine, biology and space applications. Similar features found their way inside high energy physics with applications in vertex detectors for high-luminosity LHC Upgrades, with 3D sensors, 3D integration and efficient power management using silicon micro-channel cooling. This paper reports on the state of this development.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
