Abstract
Glass for use as an Interposers with through vias (TGV) are emerging as the next generation substrates for die level and wafer level packaging substrates. This need is being driven increasing number of interconnects, desire to have a KGD (known good die) at the wafer level package (WLP), high electrical/thermal conductivity vias, and hermeticity between the PWB and the die, while being cost competitive with a TSV passive interposer. These TGV characteristics translate to longer battery life, higher yield at the end user applications, and an optimized WLP solution that not require silicon processing foundries to fabricate a passive interposer. The next generation of communication devices will operate at much higher frequencies to allow video on demand and video vis a vis communication. Coupled with multiple frequencies, to facilitate a phone to work with GSM, CDMA and other communication schemes require multiple filter and low noise amplifiers. This paper will describe work done with Alkali free, copper filled (not plated) hermetic vias that are both low cost and provide engineering design flexibility for the more advance low cost personal handheld devices.
Published Version
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