Abstract
Structure design and thermal simulation of MEMS-based thermal infrared (TIR) emitter integrated with Si-based microchannel heatsink (MCHS) were presented for gas sensing application. The MCHS attached on the bottom of TIR emitter was used to transfer heat to coolant for improving the transient response characteristics of TIR emitters. A three-dimensional finite element method was used to analyze the electrical heating and heat transfer behaviors of the TIR emitter with MCHS through COMSOL Multiphysics® platform. The surface temperature distribution and transient response were simulated when different flow velocities of coolant passed through the MCHS, and the influence of the flow velocity on the response characteristics was analyzed. The result shows that the temperature in the Si frame of TIR emitters will be significant reduced when the flow velocity of coolant is larger than 0.5 m/s, which will enable an effective improvement in the response characteristics of MEMS TIR emitters.
Published Version
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