Abstract
This paper deals with the reliability of power device assembly. We make use of 3D electro-thermo-mechanical simulations tools to highlight the power chip deformation during its conducting state. Moreover, we carry out experimental deformation measurement using a T.D.M® (Topography and Deformation Measurement) equipment. These simulations and measurements could allow to evaluate the reached mechanical stress level in a power assembly (in the different materials and at the different interfaces) during power device operation.
Full Text
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call