Abstract
Advances in the brightness, efficiency, and dynamic range of emissive displays are made possible by integrating microLEDs inside every pixel. Economical realization of these displays demands a diverse set of process technologies and device designs to accommodate the characteristics of microLEDs in large‐area formats. Here, we present advancements in stamp‐based mass transfer. We present schemes for packaging microLEDs into multi‐color emitter structures that interface readily with backplane materials. The structures reduce mass transfer cost by increasing parallelism of the process. We demonstrate their utility in active pixel arrays that use microICs as drivers. We introduce a coverglass with light trap film stacks for enhancing contrast in microLED displays. Finally, we present a surface mountable device that incorporates these technologies into a format that is applicable to videowalls and digital signage.
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