20th International Conference on Electron Dynamics in Semiconductors, Optoelectronics and Nanostructures (EDISON 20)

Abstract

The 20th International Conference on Electron Dynamics in Semiconductors, Optoelectronics and Nanostructures (EDISON 20) was held at the Hyatt Regency Hotel and Conference Center in downtown Buffalo, New York, USA from July 17–21, 2017. The meeting serves as the premier forum for researchers working on the study of nonequilibrium phenomena in semiconductors, from all parts of the globe, and was organized locally by faculty at the University at Buffalo and the University of Rochester.EDISON is an international conference series with biennial meetings that cover recent progress in the field of electron dynamics in solid-state materials and devices. Initially established with the title Hot Carriers in Semiconductors (HCIS), the first meeting took place in Modena, Italy in 1973. The name was changed to International Conference on Nonequilibrium Carrier Dynamics in Semiconductors at the 1997 Berlin meeting, and again at the 2009 meeting in Montpellier to the current form. Since then, EDISON conferences have been held in Santa Barbara, USA (2011); Matsue, Japan (2013); Salamanca, Spain (2015); and Buffalo, USA (2017).The EDISON 20 program included 12 invited talks, 50 oral contributions, 116 accepted abstracts, and one special seminar. In total, 152 participants from 22 countries gathered to share and exchange ideas and recent results. Approximately 45% of the participants were from North America, 30% from Europe, and 25% from the Asia Pacific region. Fully 30% of the participants were students, and there was a very good balance between experimental and theoretical approaches. Topics with the most contributions were: Electronic and optical properties of graphene and other 2D materials; Nonequilibrium carrier transport; and Terahertz phenomena in semiconductor materials and devices.I thank all the members of the Program Committee and the International Advisory Committee for their valuable input, as well as Professor Jonathan Bird and Alex Desha for their many hours devoted to organizing a successful EDISON conference. Also critical to the success of the conference is financial support, so I thank the School of Engineering and Applied Sciences, the Vice President for Research and Economic Development, the Department of Physics, and the Department of Electrical Engineering at the University at Buffalo, as well as the U.S. Department of Energy, Kurt J. Lesker Company, and the Hajim School of Engineering & Applied Sciences at the University of Rochester for their sponsorship of EDISON 20. Finally, I thank all the scientists who contributed to the preparation and peer-review of these proceedings.Erik Einarsson, EditorEDISON 20 Publications ChairUniversity at Buffalo