Abstract
The Flexible Universal Plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a novel debonding method. Low Temperature Poly Silicon (LTPS) TFTs and OLEDs were developed along with the FlexUP technology, aiming to realize the foldability of AMOLED. With foldable AMOLED, the toughest challenge lies in the folding area with highly concentrated stress and fatigue which, when left unmanaged, will cause the product to fail. We have proposed several approaches to overcome these issues and have successfully demonstrated foldable AMOLED with touch panel modules at 5mm folding radius.
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