16x Multisite, High Current and High Power density Test Solution for Power Protection Device

Abstract

TPS2595x family is the integrated FET hot-swap devices (eFuses) for front end power protection and management. This 5A eFuse enables high power integration at system level by small package size of 2mm x 2mm Quad-Flat-NoLead (QFN) package. Final test poses multiple challenges at this package size and current when it comes to the reliability and longevity at production test. TPS2595x family requires high current (5A) production test on the ultra-small PAD of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$250\mu \mathrm{m}^{*}300\mu \mathrm{m}$</tex> . And the need of kelvin tests reduces the touch down area further to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$&lt; 150\mu \mathrm{m}$</tex> for each socket-pin. Also the target was 50% or more reduction in test cost. It required doubling of multisite from 8x to 16x with same tester configuration. This test cost target added to more challenges like sharing of high-current resources at tester, real estate area issues on PCB and high power density near device under test (DUT) area on the strip handler. In this paper we will be discussing how these challenges are solved without any compromise in test quality & coverage and still achieving lower test cost.