Abstract

For the first time, a 1200 V 4H-SiC power MOSFET with a monolithically integrated gate buffer circuit has been demonstrated successfully. The device used a 6x1015cm-3doped, 10 μm thick n-type drift layer to support 1200 V. The gate buffer circuit was built in a p-well, formed by boron ion implantation. The integrated device provided sufficient voltage isolation for the control circuit from the drain of the power MOSFET, and supported internal supply voltages up to 20 V. The operation of the integrated devices was demonstrated. A specific on-resistance (Ron,sp) of 20 mΩ-cm2was observed. The highRon,spwas due to the limitations in NMOS pull-up circuit topology and the body effect in the 4H-SiC NMOSFET. Development of PMOS pull-up devices is recommended for future integration efforts.

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