Abstract
This chapter discusses the use of adhesives in electronics. Epoxy adhesives typically contain several chemical components, the most important being the epoxy resin constituting the base of the formulation. All these additives have a considerable effect on the properties of the adhesive composition before, during, and after the curing process. All epoxy resins used in the fabrication of conductive adhesives are commercially available materials. They can be aromatic, cycloaliphatic or aliphatic, monofunctional or polyfunctional, physically ranging from low-viscosity liquids to high-melting solids. In the electronic industry, phenols are widely used as coreactants of epoxy novolac resins to encapsulate the integrated circuits. Thin polyimide films are formed on the surface of silicon wafers by depositing a solution of polyamic acid, which is then subjected to a thermal treatment to perform the cyclodehydration reaction yielding ultimately the heterocyclic polymer.
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