11 - Packaging

Abstract

This chapter discusses recent developments in packaging technology for III–V optoelectronic devices, high density, multifunctional and multichannel devices for optical interconnect applications, and GaAs digital and monolithic microwave integrated circuit. Common to all packaging designs, the three major concerns for all electronic and optoelectronic device packaging are form, fit, and function. A person who designs a III–V electronic or optoelectronic package should anticipate the probable packaging standards and the requirements for commercial or military applications. The important functions of an electronic or optoelectronic package are to provide a mechanical support for the electronic circuits, the optoelectronic device, the fibers, the microlenses, and other components; environmental protection for the devices; proper pin count and impedance-matching for electrical interconnection; a stable enclosure to maintain reliable alignment of all optical components; and an efficient path for heat transfer from the devices inside to the ambient outside the package. III–V electronic and optoelectronic packages should be designed with these important considerations.