10 - Powering complex FPGA-based systems using highly integrated DC/DC µModule regulator systems: Part 2 of 2 Thermal performance and layout

Abstract

The new approach uses four DC/DC μModule™ regulators in parallel to increase the output current while sharing the current equally among each device. This solution relies on the accurate current sharing of these μModule regulators to prevent hot-spots by dissipating the heat evenly over a compact surface area. Each DC/DC μModule is a complete power supply with on-board inductor, DC/DC controller metal–oxide–semiconductor field-effect transistors, compensation circuitry, and input/output bypass capacitors. It occupies only 15 mm × 15 mm of board area and has a low profile (height) of only 2.8 mm. This low profile allows air to flow smoothly over the entire circuit. Moreover, this solution casts no thermal shadow on its surrounding components, further assisting in optimizing the thermal performance of the entire system. The DC/DC μModule family is designed with careful attention to the layout of its internal components, package type, and electrical operation, which ease thermal management of a very dense power supply circuit. The land grid array package and simple layout allow a 100% surface mountable and low profile design for maximum efficiency in airflow. This new approach in the power supply design takes advantage of paralleling multiple DC/DC μModule regulators and following a copy and paste approach in the layout design to provide a 60 W power supply with minimum components while operating efficiently in a compact and low profile space.